This device is a Surmount™ X-Band monolithic
SPDT switch designed for high power, high
performance applications. This Surface Mount
chipscale configuration is designed with minimal
parasitics usually associated with hybrid MIC
designs incorporating beam lead and/or bondable
PIN diodes that require chip and wire assembly.
This device is fabricated using MACOM's patented HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of
silicon pedestals that form series and shunt diodes
and/or vias by embedding them in low loss, low
Selective backside metalization is applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge
during handling and assembly.