Product Detail

HMIC PIN Diode, SP2T Siwtch
The MASW-011052 device is a SP2T broad band switch with integrated bias networks utilizing MACOM’s patented HMIC (Heterolithic Microwave Integrated Circuit) process. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders or electrically conductive silver epoxy.
  • Broad Bandwidth Specified up to 18 GHz
  • Fully Monolithic
  • Low Insertion Loss / High Isolation
  • Integrated Bias Network
  • Usable up to 26 GHz
  • RoHS Compliant* and 260°C Reflow Compatible
  • Glass Encapsulate Construction
  • Aerospace and Defense
  • Communications and DataLinks
  • EW
  • ISM
  • Radar
  • Test and Instrumentation
  • Min Frequency: 2,000 MHz
  • Max Frequency: 26,000 MHz
  • Insertion Loss : 0.8 dB
  • Isolation: 59 dB
  • IIP3: 43 dBm
  • CW Incident Power: 2 W
  • DIE
Package Category
  • Die/Bumped Die
  • Yes
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
Switch, SP2T, Die, HMIC PIN, Bias Network
In Stock: 200
Switch, SP2T, Die, HMIC PIN, Bias Network
DIE Inquire Buy

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