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MACOM’s mixers can be used in a wide variety of applications such as modulators, phase detectors, frequency synthesizers, and converters. They are ideal for use in CATV head end systems and up converter applications. Our low cost, passive mixers are constructed using broadband ferrite balun transformers and matched silicon Schottky diodes.
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Parametric Search
| Part Number | Ordering | Short Description | Min Frequency, RF/LO (MHz) | Max Frequency, RF/LO (MHz) | Min Frequency, IF (MHz) | Max Frequency, IF (MHz) | IIP3 (dBm) | ROHS | Package | Model Data (Sparameters) | Product Image | LO Drive (dBm) | Isolation LO-RF (dB) | Input P1dB (dBm) | 75 Ohm | Package Category | Lead-Free | Datasheet | Application Notes | Features | Conversion Loss (dB) | Brightcove Video | Content | Xmicrowave URL | Xmicrowave Image |
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| MAMX-011009 | Inquire |
Sub-Harmonic Pumped Mixer 14 - 32 GHz
|
14000 | 32000 | 0 | 7000 |
Yes
|
1.5X1.2mm TDFN-6LD
|
1.2x1.5mm_6-lead.jpg
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25 |
No
|
Plastic Surface Mount
|
Yes
|
MAMX-011009.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages AG314 - Principles, Applications and Selection of Receiving Diodes AG314 - Principles, Applications and Selection of Receiving Diodes |
Up or Down Frequency Mixer
LO Frequency: 4 - 20 GHz RF Frequency: 14 - 32 GHz 2xLO & 3xLO Rejection: 50 dB Low Conversion Loss: 11 dB Halogen-Free “Green” Mold Compound Lead-Free 1.5x1.2 mm 6-lead TDFN Package IF Frequency: DC - 7 GHz RoHS* Complaint 260°C Reflow Compatible |
-10 |
3203639724001
|
http://www.xmicrowave.com/product/xm-a4a4-0404d/
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Xmicrowave.png
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| MAMX-009239-001500 | Buy |
E-Series Surface Mount Mixer 10 – 2500 MHz
|
10 | 2500 | 10 | 2500 |
SM-87
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SM 87 - MAMX-009239-001500.JPG
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17 | 9 | 13 |
No
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FR4 Surface Mount
|
No
|
MAMX-009239-001500.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices AG314 - Principles, Applications and Selection of Receiving Diodes |
Lo Power: +17 dBm
RoHS* Compliant Wide Frequency Band · Surface Mount Up to +13 dBm RF Tape and Reel Packaging |
9 | |||||||
| MAMX-009722-25MHLP | Inquire |
E-Series Surface Mount Mixer 30-512 MHz
|
30 | 512 |
SM-89
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SM 89 - MAMX-009722-25MHLP.JPG
|
23 | 45 |
No
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FR4 Surface Mount
|
Yes
|
MAMX-009722-25MHLP.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices AG314 - Principles, Applications and Selection of Receiving Diodes |
Lo Power: +13 dBm
RoHS* Compliant 260°C Reflow Compatible Tape and Reel Packaging Available Surface Mount Up to +9 dBm RF |
7.5 | ||||||||||
| MA4EX600L1-1225T | Inquire |
Silicon Double Balanced HMIC Mixer 1700 – 2500 MHz
|
4200 | 6000 | 0 | 2000 |
Yes
|
SOT-25
|
MA4EX600L1-1225T.PNG
|
5 | 28 | 6.9 |
No
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Plastic Surface Mount
|
Yes
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MA4EX600L1-1225.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
SOT-25 Low Cost Miniature Plastic Package
No External Matching Required HMICTM Patented Process + 3 to + 7 dBm Lo Drive 6.4 dB Typical Conversion Loss @ 5000 MHz Lead Free ( RoHS Compliant ) with 260 °C Reflow Capability Double Balanced Passive Mixer 100 % Matte Tin Plating |
5.8 | ||||||
| MAMX-000900-1061LT | Inquire |
Silicon Double Balanced HMIC Mixer 700—1400 MHz
|
700 | 1400 | 0 | 400 |
SOIC8
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soic-8.jpg
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7 | 37 | 1.9 |
No
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Plastic Surface Mount
|
Yes
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MAMX-000900-1061LT.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
+ 3 to + 7 dBm
RoHS* Compliant 100% Matte Tin Plating Low Cost Surface Mount Package No External Matching Required Fully Balanced Passive Mixer 260 °C Reflow Capability |
6.7 | |||||||
| MA4EXP950H1-1277T | Buy |
Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
|
850 | 1050 | 0 | 200 |
3mm PQFN-16LD
|
3x3 mm-16 lead PQFN (LP).jpg
|
15 | 55 | 12.7 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EXP950H1-1277T.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages AG314 - Principles, Applications and Selection of Receiving Diodes AG314 - Principles, Applications and Selection of Receiving Diodes |
+ 35 dBm Typical Input IP3
RoHS* Compliant with 260 °C. Reflow Capability Low Cost Miniature Plastic MLP Package NO External Matching Required Fully Balanced Passive Mixer + 15 to + 19 dBm LO Drive 8. 3 dB Typical Conversion Loss 100% MATTE Tin Plating |
8.3 | |||||||
| MAMX-008611 | Inquire |
Low Cost MMIC Mixer with Local Oscillator Amplifier 0.8 - 1.0 GHz
|
800 | 1000 | 170 |
SOT-26
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SOT-26.jpg
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-5 | 28 | 14 |
No
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Plastic Surface Mount
|
Yes
|
MAMX-008611.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
-5 to +5 dBm LO Drive Level
260°C Re-flow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead Free SOT-26 package High Isolation, 28 dB LO to RF RoHS Compliant Version of MD57-0001 |
9.3 | ||||||||
| MAMX-000950-1225MT | Buy |
Silicon Doubled Balanced HMIC Mixer 700 - 1200 MHz
|
700 | 1200 | 0 | 400 |
3mm PQFN-16LD
|
3x3 mm-16 lead PQFN (LP).jpg
|
10 | 62 | 8.1 |
No
|
Plastic Surface Mount
|
Yes
|
MAMX-000950-1225MT.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages AG314 - Principles, Applications and Selection of Receiving Diodes AG314 - Principles, Applications and Selection of Receiving Diodes |
SOT-25 Low Cost Miniature Plastic Package
100% Matte Tin Plating DC - 400 MHz IF Bandwidth Silicon Medium Barrier Schottky Diodes HMIC™ Patented Process +7 to +13 dBm LO Drive 7.0 dB Typical Conversion Loss RoHS* Compliant 260 °C Reflow Capability |
8.2 | |||||||
| MAMX-007238-CM25MH | Buy |
E-Series Surface Mount Mixer 5-2500 MHz
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2 | 2500 | 2 | 2500 |
SM-87
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SM 87 - MAMX-007238-CM25MH.JPG
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13 | 20 | 1 |
No
|
FR4 Surface Mount
|
Yes
|
MAMX-007238-CM25MH.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices AG314 - Principles, Applications and Selection of Receiving Diodes |
Lo Power +13 dBm
RoHS* compliant version of the ELCM-25MH 260°C Reflow Compatible Tape and Reel Packaging Available Surface Mount Up to +9 dBm RF |
7.3 | |||||||
| MAMX-007607-ELCM1H | Buy |
E-Series Surface Mount Mixer 0.5 – 500 MHz
|
0.5 | 500 | 0.5 | 500 |
Yes
|
SM-87
|
SM 87 - 2.JPG
|
17 | 35 | 14 |
No
|
FR4 Surface Mount
|
Yes
|
MAMX-007607-ELCM1H.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices AG314 - Principles, Applications and Selection of Receiving Diodes |
LO Power +17 dBm
RoHS* compliant version of the ELCM-1HTR 260°C Reflow Compatible Tape and Reel Packaging Available Surface Mount Low Profile Up to +14 dBm RF |
7.2 | ||||||
| MAMX-090950-1277LT | Buy |
Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
|
850 | 1050 | 0 | 400 |
3mm PQFN-16LD
|
3x3 mm-16 lead PQFN (LP).jpg
|
7 | 62 | 4.3 |
No
|
Plastic Surface Mount
|
Yes
|
MAMX-090950-1277LT.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages AG314 - Principles, Applications and Selection of Receiving Diodes AG314 - Principles, Applications and Selection of Receiving Diodes |
Input IP3: +21 dBm (Typ.)
Lead Free Low Cost Miniature Plastic MLP Package Fully Balanced Passive Mixer Lo Drive: +5 to +10 dBm Conversion Loss: 8.3 dB (Typ,) 100% Matte Tin Plating 260°C Reflow Compatible RoHS* Compliant |
8.2 | |||||||
| MA4EXP240L-1277T | Buy |
Silicon Double Balanced HMIC Mixer 2300 - 2800 MHz
|
2300 | 2800 | 0 | 200 |
3mm PQFN-16LD
|
3x3 mm-16 lead PQFN (LP).jpg
|
5 | 51 | 4.8 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EXP240L-1277.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages AG314 - Principles, Applications and Selection of Receiving Diodes AG314 - Principles, Applications and Selection of Receiving Diodes |
+ 18 dBm Typical Input IP3
100 % MATTE Tin Plating RoHS* Compliant No External Matching Required Fully Balanced Passive Mixer + 5 to + 9 dBm LO Drive 8. 3 dB Typical Conversion Loss 260 °C Reflow Capability |
8.3 | |||||||
| MA4EX950L1-1225T | Buy |
Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
|
700 | 1200 | 0 | 400 |
Yes
|
SOT-25
|
SOT 25.JPG
|
5 | 28 | 1.5 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EX950L1-1225T.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
SOT-25 Low Cost Miniature Plastic Package •• • • • •
260°C Reflow Capability 100 % Matte Tin Plating DC - 400 MHz IF Bandwidth Silicon Low Barrier Schottky Barrier Diodes HMICTM Patented Process +3 to +7 dBm LO Drive 6.5 dB Typical Conversion Loss RoHS* Compliant |
8 |
http://www.xmicrowave.com/product/xm-a4b3-0404d/
|
Xmicrowave.png
|
||||
| MA4EX950H1-1225T | Buy |
Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
|
700 | 1200 | 0 | 400 |
Yes
|
SOT-25
|
MACOM_general.png
|
15 | 27.5 | 8.3 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EX950H1-1225T.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
7.0 dB Typical Conversion Loss
100% Matte Tin Plating Low Cost Miniature Plastic Package DC - 400 MHz IF Bandwidth Silicon High Barrier Schottky Barrier Diodes HMIC IC Process +13 to +17 dBm LO Drive RoHS* Compliant 260°C Reflow Capability |
6.6 |
http://www.xmicrowave.com/product/xm-a4b2-0404d/
|
Xmicrowave.png
|
||||
| MAMXSS0013 | Inquire |
Low Cost MMIC Mixer 1400 - 2100 MHz
|
1400 | 2100 | 0 | 500 |
Yes
|
SOT-25
|
MAMXSS0013.PNG
|
5 | 28 | 12 |
No
|
Plastic Surface Mount
|
Yes
|
MAMXSS0013.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
+12 dBm Input Power @ 1 dB Compression
RoHS* Compliant Version of MD54-0006 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOT-25 Package Does Not Require DC Bias Lo Drive Level: +3 to +8 dBm High Isolation: 28 dB LO to RF DC - 500 MHz 3 dB IF Bandwidth |
8 |
http://www.xmicrowave.com/product/xm-a4b6-0404d-2/
|
Xmicrowave.png
|
||||
| MAMXSS0010 | Buy |
MMIC Medium Level Mixer 1700 - 2000 MHz
|
1700 | 2000 | 0 | 200 |
SOIC8
|
soic-8.jpg
|
13 | 27 | 21 |
No
|
Plastic Surface Mount
|
Yes
|
MAMXSS0010.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Low Conversion Loss
Lead-Free SOIC-8 Package DC - 200 MHz IF Bandwidth Lo Drive Level: +11 to +23 dBm Typical Two-Tone IM Ratio: > 50 dBc Input Power @ 1 dB Compression: +21 dBm Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper 260°C Reflow Compatible RoHS* Compliant Version of MD54-0003 |
8.5 | |||||||
| MA4EX580L1-1225T | Buy |
Silicon Double Balanced HMIC Mixer 4.7 - 6.0 GHz
|
4700 | 6000 | 0 | 1050 |
Yes
|
SOT-25
|
doublebalancedmixer.PNG
|
5 | 23 | 1.6 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EX580L1-1225T.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Conversion Loss: 7.6 dB (Typ.)
Low Cost Miniature Plastic Package DC - 1050 MHz IF Bandwidth Silicon Low Barrier Schottky Diodes HMIC™ Patented Process LO Drive : +3 to +7 dBm Lead Free |
7.6 |
http://www.xmicrowave.com/product/xm-a4a9-0404d/
|
Xmicrowave.png
|
||||
| MAMXSS0012 | Inquire |
Low Cost MMIC Mixer 800 - 1000 MHz
|
800 | 1000 | 0 | 200 |
Yes
|
SOT-25
|
SOT 25.JPG
|
5 | 35 | 15 |
No
|
Plastic Surface Mount
|
Yes
|
MAMXSS0012.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Input Power @ 1 dB Compression: +15 dBm
Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOT-25 Package Does not require DC Bias DC - 200 MHz 3 dB IF Bandwidth LO Drive Level: +3 to +8 dBm High LO to RF Isolation: 35 dB 260°C Reflow Compatible RoHS* Compliant Version of MD54-0005 |
8 |
http://www.xmicrowave.com/product/xm-a4b5-0404d/
|
Xmicrowave.png
|
||||
| MA4EX240L1-1225T | Buy |
Silicon Double Balanced HMIC Mixer 1700 - 2500 MHz
|
1700 | 2500 | 0 | 400 |
Yes
|
SOT-25
|
doublebalancedmixer.PNG
|
5 | 17.5 | 1 |
No
|
Plastic Surface Mount
|
Yes
|
MA4EX240L1-1225T.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Low Cost Miniature Plastic Package
Silicon Low Barrier Schottky Diodes HMIC™ Patented Process +3 to +7 dBm LO Drive 7.4 dB Typical Conversion Loss at 2400 MHz 6.4 dB Typical Conversion Loss at 2100 MHz RoHS* Compliant with 260 °C. Reflow Capability DC - 400 MHz IF Bandwidth 100% MATTE Tin Plating |
7 |
http://www.xmicrowave.com/product/xm-a4a8-0404d/
|
Xmicrowave.png
|
||||
| XM1003-BD | Inquire |
Image Reject Mixer 32.0-42.0 GHz
|
32000 | 42000 | 0 | 4000 |
DIE
|
MACOM_general.png
|
-40 |
No
|
Die
|
Yes
|
XM1003-BD.pdf
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs |
Sub-harmonic Image Reject Mixer
100% Visual Inspection to MIL-STD-883 Method 2010 100% On-Wafer RF Testing Image Rejection: 18.0 dB Conversion Loss: 9.0 dB GaAs HBT Technology 260°C Reflow Compatible RoHS* Compliant |
9 | |||||||||
| XM1001-BD | Inquire |
Image Reject Mixer 12.0-40.0 GHz
|
12000 | 40000 | 0 | 4000 |
DIE
|
MACOM_general.png
|
16 |
No
|
Die
|
Yes
|
XM1001-BD.pdf
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs |
Fundamental Image Reject Mixer
RoHS* Compliant 260°C Reflow Compatible 100% Visual Inspection to MIL-STD-883 Method 2010 100% On-Wafer RF Testing Image Rejection: 20.0 dB Conversion Loss: 8.0 dB +25.0 dBm Input Third Order Intercept (IIP3) |
8 | |||||||||
| XM1002-BD | Inquire |
Image Reject Mixer 34.0-46.0 GHz
|
34000 | 46000 | 0 | 4 |
DIE
|
MACOM_general.png
|
11 |
No
|
Die
|
Yes
|
XM1002-BD.pdf
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs |
Fundamental Image Reject Mixer
260°C Reflow Compatible 100% Visual Inspection to MIL-STD-883 Method 2010 100% On-Wafer RF Testing +24 dBm Input Third Order Intercept 20.0 dB Image Rejection 7.0 dB Conversion Loss RoHS* Compliant |
8 | |||||||||
| MAMX-011023 | Inquire |
Low Noise Active Mixer, 4 – 23 GHz
|
4000 | 23000 | 0 | 8000 |
1.5x1.2mm 6 lead TDFN
|
1.2x1.5mm_6-lead.jpg
|
-2 |
No
|
Plastic Surface Mount
|
Yes
|
MAMX-011023 (1).pdf
|
Down Frequency Mixer
LO Frequency: 4 – 23 GHz RF Frequency: 4 – 23 GHz Low Power Consumption: 3v/15mA Low Noise: 7 dB Typical Conversion Gain: 7 dB Typical Halogen-Free “Green” Mold Compound Lead-Free 1.5x1.2mm 6 lead TDFN Pkg IF Frequency: DC – 8 GHz RoHS Complaint and 260oC Reflow |
7 |
Family of Mixers Training Module with Digikey.pdf
|
|||||||||
| MAMX-011021 | Inquire |
High IP3 Mixer, 5 - 33 GHz
|
5000 | 33000 | 0 | 5000 |
Yes
|
1.5x1.2mm 6 lead TDFN
|
1.2x1.5mm_6-lead.jpg
|
14 | 15 |
No
|
Plastic Surface Mount
|
Yes
|
MAMX-011021.pdf
|
Passive Frequency Mixer
LO Frequency: 3-39 GHz RF Frequency: 5-33 GHz High IIP3: +22 dBm Conversion Loss : 9 dB typical Lead-Free 1.5x1.2mm 6 lead TDFN Package IF Frequency: DC-5 GHz RoHS* Compliant and 260°C Reflow Compatible Halogen-Free “Green” Mold Compound |
9 |
Family of Mixers Training Module with Digikey.pdf
|
http://www.xmicrowave.com/product/xm-a4a5-0404d/
|
Xmicrowave.png
|
|||||
| MD-156 | Inquire | 600 | 3000 | 0 | 1000 |
FP-2
|
Flatpack package.png
|
30 |
FP-2
|
Inquire |
Noise Figure: 6.5 Typical
MIL-STD-883 Screening Available IF Port Current: 50 mA Max Maximum Input Power: 300 mW max. @ 25°C, Derated linearly to 85°C @ 3.2 mW/°C Impedance: 50 Ohms Nominal LO-RF Isolation: 30 dB Typical |
9 | |||||||||||||
| MAMX-011054 | Inquire |
Double-Balanced Mixer, 18 to 46 Ghz
|
18000 | 46000 | 0 | 20000 | 20 |
Yes
|
3mm 12-lead AQFN
|
Yes
|
3mm 12-lead AQFN
|
Yes
|
MAMX-011054.pdf
|
6.5 |
5992529658001
|
||||||||||
| MAMX-011036 | Inquire |
Double-Balanced Mixer, 8 to 43 GHz
|
8000 | 43000 | 0 | 10000 | 20 |
Yes
|
3mm 12-lead AQFN
|
12LD.png
|
Yes
|
3mm 12-lead AQFN
|
Yes
|
MAMX-011036.pdf
|
8.5 |
5992529658001
|
|||||||||
| MAMX-011037-DIE | Inquire |
Double-Balanced Mixer, 18 – 46 GHz
|
18000 | 46000 | 0 | 20000 | 20 |
Yes
|
DIE
|
General MACOM image.png
|
Bare Die
|
MAMX-011037-DIE.pdf
|
|||||||||||||
| MAMX-011036-DIE | Inquire |
Double-Balanced Mixer, 8 to 43 GHz
|
8000 | 43000 | 0 | 10000 | 22 |
Yes
|
DIE
|
MACOM Gen.png
|
Bare Die
|
MAMX-011036-DIE.pdf
|
5992529658001
|
