Join the Next Generation with MACOM at Booth #1A32 to learn more about:
- PON Components: 10/25 Gbps-PON ONU/OLT
- Telecom Portfolio: 25Gbps CDR, TIA and driver portfolios, 25Gbps FP lasers, APD photodiodes and 50 Gbps PAM-4 chipset
- Data Center Components: 100 Gbps CWDM4, DR1/FR1/LR1 and 100/200/400 Gbps PAM-4
- Long-Haul and Metro Components: 64 GBaud driver and TIA
Members of MACOM’s product management, engineering and applications teams will be available at Booth #1A32 to answer questions.
Shenzhen Convention and Exhibition Center
- Wednesday, September 4th 9:00 AM – 5:00 PM
- Thursday, September 5th 9:00 AM – 5:00 PM
- Friday, September 6th 9:00 AM – 5:00 PM
- Saturday, September 7th 9:00 AM – 4:00 PM
For more information, visit Booth #1A32 at CIOE or contact us via www.macom.com.