MACOM is Increasing Bandwidth Density in Optical Networks
Meet with MACOM at OFC 2017 at the Los Angeles Convention Center, March 21st - 23rd, in Booth #1736 and discover how MACOM is decreasing size and power consumption, and increasing port density of optical interconnects.
Leveraging deep domain experience in optical networking along with a combination of semiconductor technologies, MACOM creates innovative and smart solutions supporting cloud data center, client access, metro and long haul applications. Our complete and robust portfolio includes high performance modulator drivers, transimpedance amplifiers, clock/data recovery circuits, crosspoints, APD, PIN photodiodes, and FP and DFB lasers, silicon photonics, ROSAs and TOSAs for enterprise and telecom optical systems operating up to 100G, 400G and beyond.
The portfolio addresses the high performance analog interfaces between electrical and optical domains, and provides solutions to meet the demanding size, power and signal integrity requirements of today’s high speed networks—which are expanding to meet the continuously growing demand for data capacity. Product demonstrations at the show include:
Demonstrations will be on display by appointment only in MACOM’s booth, #1736.
Members of MACOM’s product management, engineering and applications teams will be available to answer any inquiries or questions at the show. Contact your local sales representative to set up a meeting today.
List to MACOM' Experts Present:
III-V + Silicon: To Integrate or to Co-package?
MACOM's Rich Grzybowski to serve as a panelist, discussing the prospects and challenges of heterogeneous integration in silicon photonics.
Sunday, March 19th 3:30 – 6:30 PM, Room # 408B
Overcoming the Challenges in Large-Scale Integrated Photonics
MACOM's Roe Hemenway to address market opportunities for integrated photonic modules in data centers and other traditional application spaces.
Monday, March 20th 1:30 – 3:50 / 4:00 – 6:00 PM
Fireside Chat: Growth & Profitability in Optical Networking - Boom and Bust or Sustainable?
MACOM's Preet Virk to participate in this OSA Executive Forum
Monday, March 20th, 4:30 – 5:45 PM
Component Suppliers’ Vision
MACOM’s Bart Zeydel will participate in this OIF Workshop addressing potential electrical link and interconnect technologies being developed to support serial data rates of 100 Gb/s and higher.
Thursday, March 23rd, 3:00 – 6:00 PM
Los Angeles Convention Center
10:00 – 17:00 March 21
10:00 – 17:00 March 22
10:00 – 16:00 March 23
For more information about OFC 2017 click here